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Panasonic SMT NPM W2 8

Panasonic – NPM-W2 Modular Placement Machine

Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.

Request a Brochure
Make an Enquiry

Panasonic – NPM-W2 Modular Placement Machine

Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.

Panasonic logo bl nega PNG
Panasonic SMT NPM W2 8
Request a Brochure
Make an Enquiry

Panasonic – NPM-W2

Modular Placement Machine

Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.

Panasonic SMT NPM W2 8
Panasonic logo bl nega PNG
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Make an Enquiry

Machine Specifications

Model ID
NPM-W2
Rear head

Front head

Lightweight
16-nozzle head
12-nozzle head
Lightweight
8-nozzle head
3-nozzle head V2
Dispensing head
No head
Lightweight 16-nozzle head
NM-EJM7D
NM-EJM7D-MD
NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head
NM-EJM7D-MD
NM-EJM7D-D
Inspection head
NM-EJM7D-MA
NM-EJM7D-A
No head
NM-EJM7D
NM-EJM7D-D

 

PCB
dimensions
(mm)
Single-lane*1 Batch
mounting
L 50 x W 50 ~ L 750 x W 550
2-positin
mounting
L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option
configuration.)


Placement head
Lightweight 16-nozzle head
(Per head)
12-nozzle head
(Per head)
Lightweight 8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode
[ON]
High production mode
[OFF]
High production mode
[ON]
High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)
35 000cph
(0.103 s/ chip)
32 250cph
(0.112 s/ chip)
31 250cph
(0.115 s/ chip)
20 800cph
(0.173 s/ chip)
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)
±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
± 30 µm/QFP
Component
dimensions
(mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply
Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick
Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray
Single tray specifications : Max.20
Twin tray specifications : Max.40

Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ
rotation)
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP

Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP,
BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP,
BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection
*12
Inspection position accuracy *13
( Cpk1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine
Panasonic SMT NPM W2 6
*1 :

Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.

*2

: Only for main body

*3

: 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.

*4

: Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm

*5

: Excluding the monitor, signal tower and ceiling fan cover.

*6

: ±25 μm placement support option.(Under conditions specified by PSFS)

*7

: The 03015/0402 chip requires a specific nozzle/feeder.

*8

: Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)

*9

: A PCB height measurement time of 0.5s is included.

*10

: One head cannot handle solder inspection and component inspection at the same time.

*11

: Please refer to the specification booklet for details.

*12

: Foreign object is available to chip components.(Excluding 03015 mm chip)

*13

: This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

 

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions

*Please refer to the specification booklet for details.

Request a Brochure
Make an Enquiry

Machine Specifications

Model ID
NPM-W2
Rear head

Front head

Lightweight
16-nozzle head
12-nozzle head
Lightweight
8-nozzle head
3-nozzle head V2
Dispensing head
No head
Lightweight 16-nozzle head
NM-EJM7D
NM-EJM7D-MD
NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head
NM-EJM7D-MD
NM-EJM7D-D
Inspection head
NM-EJM7D-MA
NM-EJM7D-A
No head
NM-EJM7D
NM-EJM7D-D

 

PCB
dimensions
(mm)
Single-lane*1 Batch
mounting
L 50 x W 50 ~ L 750 x W 550
2-positin
mounting
L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option
configuration.)


Placement head
Lightweight 16-nozzle head
(Per head)
12-nozzle head
(Per head)
Lightweight 8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode
[ON]
High production mode
[OFF]
High production mode
[ON]
High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)
35 000cph
(0.103 s/ chip)
32 250cph
(0.112 s/ chip)
31 250cph
(0.115 s/ chip)
20 800cph
(0.173 s/ chip)
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)
±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
± 30 µm/QFP
Component
dimensions
(mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply
Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick
Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray
Single tray specifications : Max.20
Twin tray specifications : Max.40

Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ
rotation)
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP

Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP,
BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP,
BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection
*12
Inspection position accuracy *13
( Cpk1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine
Panasonic SMT NPM W2 6
*1 :

Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.

*2

: Only for main body

*3

: 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.

*4

: Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm

*5

: Excluding the monitor, signal tower and ceiling fan cover.

*6

: ±25 μm placement support option.(Under conditions specified by PSFS)

*7

: The 03015/0402 chip requires a specific nozzle/feeder.

*8

: Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)

*9

: A PCB height measurement time of 0.5s is included.

*10

: One head cannot handle solder inspection and component inspection at the same time.

*11

: Please refer to the specification booklet for details.

*12

: Foreign object is available to chip components.(Excluding 03015 mm chip)

*13

: This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

 

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions

*Please refer to the specification booklet for details.

Request a Brochure
Make an Enquiry

Machine Specifications

Model ID
NPM-W2
Rear head

Front head

Lightweight
16-nozzle head
12-nozzle head
Lightweight
8-nozzle head
3-nozzle head V2
Dispensing head
No head
Lightweight 16-nozzle head
NM-EJM7D
NM-EJM7D-MD
NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head
NM-EJM7D-MD
NM-EJM7D-D
Inspection head
NM-EJM7D-MA
NM-EJM7D-A
No head
NM-EJM7D
NM-EJM7D-D

 

PCB
dimensions
(mm)
Single-lane*1 Batch
mounting
L 50 x W 50 ~ L 750 x W 550
2-positin
mounting
L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option
configuration.)


Placement head
Lightweight 16-nozzle head
(Per head)
12-nozzle head
(Per head)
Lightweight 8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode
[ON]
High production mode
[OFF]
High production mode
[ON]
High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)
35 000cph
(0.103 s/ chip)
32 250cph
(0.112 s/ chip)
31 250cph
(0.115 s/ chip)
20 800cph
(0.173 s/ chip)
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)
±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
± 30 µm/QFP
Component
dimensions
(mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply
Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick
Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray
Single tray specifications : Max.20
Twin tray specifications : Max.40

Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ
rotation)
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP

Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP,
BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP,
BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil,
Connector*11
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection
*12
Inspection position accuracy *13
( Cpk1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine
Panasonic SMT NPM W2 6
*1 :

Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.

*2

: Only for main body

*3

: 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.

*4

: Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm

*5

: Excluding the monitor, signal tower and ceiling fan cover.

*6

: ±25 μm placement support option.(Under conditions specified by PSFS)

*7

: The 03015/0402 chip requires a specific nozzle/feeder.

*8

: Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)

*9

: A PCB height measurement time of 0.5s is included.

*10

: One head cannot handle solder inspection and component inspection at the same time.

*11

: Please refer to the specification booklet for details.

*12

: Foreign object is available to chip components.(Excluding 03015 mm chip)

*13

: This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

 

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions

*Please refer to the specification booklet for details.

Request a Brochure
Make an Enquiry

Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]

Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]

Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]