Panasonic – NPM-W2 Modular Placement Machine
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
Panasonic – NPM-W2 Modular Placement Machine
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
Panasonic – NPM-W2
Modular Placement Machine
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market. This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements. In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used. The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted. Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data. As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
Machine Specifications
| Model ID |
NPM-W2
|
|||||
|
Rear head
Front head |
Lightweight
16-nozzle head |
12-nozzle head
|
Lightweight
8-nozzle head |
3-nozzle head V2
|
Dispensing head
|
No head
|
| Lightweight 16-nozzle head |
NM-EJM7D
|
NM-EJM7D-MD
|
NM-EJM7D
|
|||
| 12-nozzle head | ||||||
| Lightweight 8-nozzle head | ||||||
| 3-nozzle head V2 | ||||||
| Dispensing head |
NM-EJM7D-MD
|
–
|
NM-EJM7D-D
|
|||
| Inspection head |
NM-EJM7D-MA
|
NM-EJM7D-A
|
||||
| No head |
NM-EJM7D
|
NM-EJM7D-D
|
–
|
|||
|
PCB
dimensions (mm) |
Single-lane*1 | Batch mounting |
L 50 x W 50 ~ L 750 x W 550 |
| 2-positin mounting |
L 50 x W 50 ~ L 350 x W 550 | ||
| Dual-lane*1 | Dual transfer (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
| Dual transfer (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Single transfer (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
| Single transfer (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | ||
| Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| Mass | 2 470 kg (Only for main body : This differs depending on the option configuration.) |
||
Placement head |
Lightweight 16-nozzle head (Per head) |
12-nozzle head (Per head) |
Lightweight 8-nozzle head (Per head) |
3-nozzle head V2 (Per head) |
|||
|
High production mode [ON] |
High production mode [OFF] |
High production mode [ON] |
High production mode [OFF] |
||||
| Max. speed |
38 500cph (0.094 s/ chip) |
35 000cph (0.103 s/ chip) |
32 250cph (0.112 s/ chip) |
31 250cph (0.115 s/ chip) |
20 800cph (0.173 s/ chip) |
8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP) |
|
|
Placement accuracy (Cpk1) |
±40 μm / chip |
±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip | ±30 μm / chip |
± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP |
± 30 µm/QFP | |
|
Component dimensions (mm) |
0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402*7 chip ~ L 12 x W 12 x T 6.5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip to L 150 x W 25 (diagonal152) x T 30 | ||
|
Component supply |
Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
| Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left) |
||||||
| Stick | – |
Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder) |
|||||
| Tray | – |
Single tray specifications : Max.20 Twin tray specifications : Max.40 |
|||||
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) |
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
Adhesive position accuracy (Cpk 1)
|
± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||
| Resolution | 18 µm | 9 µm | ||
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||
|
Inspection processing time |
Solder Inspection *10 |
0.35s/ View size | ||
|
Component Inspection *10 |
0.5s/ View size | |||
|
Inspection object |
Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more |
|
|
Component Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
||
|
Inspection items |
Solder Inspection *10 |
Oozing, blur, misalignment, abnormal shape, bridging | ||
|
Component Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 |
|||
|
Inspection position accuracy *13 ( Cpk1) |
± 20 μm | ± 10 μm | ||
|
No. of inspection |
Solder Inspection *10 |
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||
|
Component Inspection *10 |
Max. 10 000 pcs./machine | |||
| *1 | : |
Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. |
|
*2 |
: | Only for main body |
|
*3 |
: | 1 880 mm in width if extension conveyors (300 mm) are placed on both sides. |
|
*4 |
: | Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm |
|
*5 |
: | Excluding the monitor, signal tower and ceiling fan cover. |
|
*6 |
: | ±25 μm placement support option.(Under conditions specified by PSFS) |
|
*7 |
: | The 03015/0402 chip requires a specific nozzle/feeder. |
|
*8 |
: | Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip) |
|
*9 |
: | A PCB height measurement time of 0.5s is included. |
|
*10 |
: | One head cannot handle solder inspection and component inspection at the same time. |
|
*11 |
: | Please refer to the specification booklet for details. |
|
*12 |
: | Foreign object is available to chip components.(Excluding 03015 mm chip) |
|
*13 |
: | This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
Machine Specifications
| Model ID |
NPM-W2
|
|||||
|
Rear head
Front head |
Lightweight
16-nozzle head |
12-nozzle head
|
Lightweight
8-nozzle head |
3-nozzle head V2
|
Dispensing head
|
No head
|
| Lightweight 16-nozzle head |
NM-EJM7D
|
NM-EJM7D-MD
|
NM-EJM7D
|
|||
| 12-nozzle head | ||||||
| Lightweight 8-nozzle head | ||||||
| 3-nozzle head V2 | ||||||
| Dispensing head |
NM-EJM7D-MD
|
–
|
NM-EJM7D-D
|
|||
| Inspection head |
NM-EJM7D-MA
|
NM-EJM7D-A
|
||||
| No head |
NM-EJM7D
|
NM-EJM7D-D
|
–
|
|||
|
PCB
dimensions (mm) |
Single-lane*1 | Batch mounting |
L 50 x W 50 ~ L 750 x W 550 |
| 2-positin mounting |
L 50 x W 50 ~ L 350 x W 550 | ||
| Dual-lane*1 | Dual transfer (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
| Dual transfer (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Single transfer (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
| Single transfer (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | ||
| Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| Mass | 2 470 kg (Only for main body : This differs depending on the option configuration.) |
||
Placement head |
Lightweight 16-nozzle head (Per head) |
12-nozzle head (Per head) |
Lightweight 8-nozzle head (Per head) |
3-nozzle head V2 (Per head) |
|||
|
High production mode [ON] |
High production mode [OFF] |
High production mode [ON] |
High production mode [OFF] |
||||
| Max. speed |
38 500cph (0.094 s/ chip) |
35 000cph (0.103 s/ chip) |
32 250cph (0.112 s/ chip) |
31 250cph (0.115 s/ chip) |
20 800cph (0.173 s/ chip) |
8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP) |
|
|
Placement accuracy (Cpk1) |
±40 μm / chip |
±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip | ±30 μm / chip |
± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP |
± 30 µm/QFP | |
|
Component dimensions (mm) |
0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402*7 chip ~ L 12 x W 12 x T 6.5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip to L 150 x W 25 (diagonal152) x T 30 | ||
|
Component supply |
Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
| Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left) |
||||||
| Stick | – |
Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder) |
|||||
| Tray | – |
Single tray specifications : Max.20 Twin tray specifications : Max.40 |
|||||
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) |
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
|
Adhesive position accuracy (Cpk1)
|
± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||
| Resolution | 18 µm | 9 µm | ||
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||
|
Inspection processing time |
Solder Inspection *10 |
0.35s/ View size | ||
|
Component Inspection *10 |
0.5s/ View size | |||
|
Inspection object |
Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more |
|
|
Component Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
||
|
Inspection items |
Solder Inspection *10 |
Oozing, blur, misalignment, abnormal shape, bridging | ||
|
Component Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 |
|||
|
Inspection position accuracy *13 ( Cpk1) |
± 20 μm | ± 10 μm | ||
|
No. of inspection |
Solder Inspection *10 |
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||
|
Component Inspection *10 |
Max. 10 000 pcs./machine | |||
| *1 | : |
Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. |
|
*2 |
: | Only for main body |
|
*3 |
: | 1 880 mm in width if extension conveyors (300 mm) are placed on both sides. |
|
*4 |
: | Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm |
|
*5 |
: | Excluding the monitor, signal tower and ceiling fan cover. |
|
*6 |
: | ±25 μm placement support option.(Under conditions specified by PSFS) |
|
*7 |
: | The 03015/0402 chip requires a specific nozzle/feeder. |
|
*8 |
: | Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip) |
|
*9 |
: | A PCB height measurement time of 0.5s is included. |
|
*10 |
: | One head cannot handle solder inspection and component inspection at the same time. |
|
*11 |
: | Please refer to the specification booklet for details. |
|
*12 |
: | Foreign object is available to chip components.(Excluding 03015 mm chip) |
|
*13 |
: | This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
Machine Specifications
| Model ID |
NPM-W2
|
|||||
|
Rear head
Front head |
Lightweight
16-nozzle head |
12-nozzle head
|
Lightweight
8-nozzle head |
3-nozzle head V2
|
Dispensing head
|
No head
|
| Lightweight 16-nozzle head |
NM-EJM7D
|
NM-EJM7D-MD
|
NM-EJM7D
|
|||
| 12-nozzle head | ||||||
| Lightweight 8-nozzle head | ||||||
| 3-nozzle head V2 | ||||||
| Dispensing head |
NM-EJM7D-MD
|
–
|
NM-EJM7D-D
|
|||
| Inspection head |
NM-EJM7D-MA
|
NM-EJM7D-A
|
||||
| No head |
NM-EJM7D
|
NM-EJM7D-D
|
–
|
|||
|
PCB
dimensions (mm) |
Single-lane*1 | Batch mounting |
L 50 x W 50 ~ L 750 x W 550 |
| 2-positin mounting |
L 50 x W 50 ~ L 350 x W 550 | ||
| Dual-lane*1 | Dual transfer (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
| Dual transfer (2-positin) | L 50 × W 50 ~ L 350 × W 260 | ||
| Single transfer (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
| Single transfer (2-positin) | L 50 × W 50 ~ L 350 × W 510 | ||
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
| Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | ||
| Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
| Mass | 2 470 kg (Only for main body : This differs depending on the option configuration.) |
||
Placement head |
Lightweight 16-nozzle head (Per head) |
12-nozzle head (Per head) |
Lightweight 8-nozzle head (Per head) |
3-nozzle head V2 (Per head) |
|||
|
High production mode [ON] |
High production mode [OFF] |
High production mode [ON] |
High production mode [OFF] |
||||
| Max. speed |
38 500cph (0.094 s/ chip) |
35 000cph (0.103 s/ chip) |
32 250cph (0.112 s/ chip) |
31 250cph (0.115 s/ chip) |
20 800cph (0.173 s/ chip) |
8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP) |
|
|
Placement accuracy (Cpk1) |
±40 μm / chip |
±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip | ±30 μm / chip |
± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP |
± 30 µm/QFP | |
|
Component dimensions (mm) |
0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402*7 chip ~ L 12 x W 12 x T 6.5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip to L 150 x W 25 (diagonal152) x T 30 | ||
|
Component supply |
Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
| Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left) |
||||||
| Stick | – |
Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder) |
|||||
| Tray | – |
Single tray specifications : Max.20 Twin tray specifications : Max.40 |
|||||
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) |
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
|
Adhesive position accuracy (Cpk1)
|
± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||
| Resolution | 18 µm | 9 µm | ||
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||
|
Inspection processing time |
Solder Inspection *10 |
0.35s/ View size | ||
|
Component Inspection *10 |
0.5s/ View size | |||
|
Inspection object |
Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more |
|
|
Component Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
||
|
Inspection items |
Solder Inspection *10 |
Oozing, blur, misalignment, abnormal shape, bridging | ||
|
Component Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 |
|||
|
Inspection position accuracy *13 ( Cpk1) |
± 20 μm | ± 10 μm | ||
|
No. of inspection |
Solder Inspection *10 |
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||
|
Component Inspection *10 |
Max. 10 000 pcs./machine | |||
| *1 | : |
Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM. |
|
*2 |
: | Only for main body |
|
*3 |
: | 1 880 mm in width if extension conveyors (300 mm) are placed on both sides. |
|
*4 |
: | Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm |
|
*5 |
: | Excluding the monitor, signal tower and ceiling fan cover. |
|
*6 |
: | ±25 μm placement support option.(Under conditions specified by PSFS) |
|
*7 |
: | The 03015/0402 chip requires a specific nozzle/feeder. |
|
*8 |
: | Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip) |
|
*9 |
: | A PCB height measurement time of 0.5s is included. |
|
*10 |
: | One head cannot handle solder inspection and component inspection at the same time. |
|
*11 |
: | Please refer to the specification booklet for details. |
|
*12 |
: | Foreign object is available to chip components.(Excluding 03015 mm chip) |
|
*13 |
: | This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
Contact Us
Detech Europe Limited
The Farm Office, Model Farm,
Atwick Road, Bewholme,
East Riding of Yorkshire,
YO25 8DT, United Kingdom
Phone: +44 (0)1262 409944
Email: sales@detech-europe.com
Contact Us
Detech Europe Limited
The Farm Office, Model Farm,
Atwick Road, Bewholme,
East Riding of Yorkshire,
YO25 8DT, United Kingdom
Phone: +44 (0)1262 409944
Email: sales@detech-europe.com
Contact Us
Detech Europe Limited
The Farm Office, Model Farm,
Atwick Road, Bewholme,
East Riding of Yorkshire,
YO25 8DT, United Kingdom
Phone: +44 (0)1262 409944
Email: sales@detech-europe.com