The MV-11e Series is Mirtec’s inline 3D SPI machine which inspects the solder amount status after the solder is spread to clearly grasp the process. With a 15 Megapixel camera contributing to productivity enhancements, 0402 (mm) pad inspection is possible.
The world’s first high resolution 15 Megapixel camera offers a more precise and stable inspection with the world’s only high speed CoaXPress transmission method to allow 4 times more data transmission and 40% increased process speed.
To reduce the error caused by the shadows when imaging high components with single projection, the dual projection probe is applied. With precise and accurate 3D measurement when imaging high components the possibility of distorted measurements due to shadowing effects is completely eliminated.