The Prey Harrier Reflow Oven series combines high-mass heat sources with efficient thermal transfer to deliver excellent reflow soldering results and high throughput, all within a compact footprint designed to maximise productivity on the factory floor.

Available in 6, 8, and 10 heating zone configurations, the Harrier range caters to production needs from low-volume prototyping to large-scale manufacturing. Each model features a pin-over-mesh belt conveyor with a standard width of 450mm (expandable to 680mm on 8- and 10-zone models), transporting PCBs through a heated tunnel of 2,300mm or longer with fully adjustable speeds for optimal thermal profiling.

Two large cooling zones ensure consistent solder joint formation and board integrity across standard and high-density designs. Advanced thermal management technology enables precise temperature control and efficient energy transfer throughout the soldering process, ensuring high-quality output regardless of component complexity or board density.

The Harrier series is engineered with versatility at its core, making it well suited to a wide range of industries including consumer electronics, automotive, medical devices, and aerospace. Whether handling simple assemblies or intricate, high-density PCBs, the Harrier range delivers the flexibility and reliability manufacturers need to meet the demands of today’s fast-evolving electronics industry.