The Harrier Reflow Oven series offers several oven lengths that offer a combination of high-mass heat soruces and effcient thermal transfer, allowing for excellent reflow soldering results and throughput with a shorter-then-average heating tunnel.

The Harrier Reflow Oven series is designed to empower SMT manufacturers with cutting-edge solutions tailored to the demands of today’s fast-evolving electronics industry. Available in 6, 8, and 10 heating zone configurations, the Harrier range caters to a wide spectrum of production needs—from compact, low-volume prototyping to high-throughput, large-scale manufacturing. Each model is equipped with a robust pin-over-mesh belt conveyor, featuring a combined rail and belt system with a standard width of 450mm (expandable to 680mm on 8- and 10-zone models). This advanced conveyor system ensures smooth and precise transport of printed circuit boards (PCBs) through a heated tunnel of 2,300mm or longer, with fully adjustable speeds to create optimal thermal profiles for even the most intricate PCB assemblies.

Every Harrier oven incorporates two large cooling zones, strategically designed to deliver consistent and reliable solder joint formation while maintaining the structural integrity of the boards. This ensures high-quality output, whether you’re working with standard components or complex, high-density designs. The series is engineered with advanced thermal management technology, enabling precise temperature control and efficient energy transfer.

The Harrier series stands out for its compact design, addressing the critical challenge of limited factory floor space. By optimizing footprint without sacrificing performance, these ovens enable manufacturers to maximize productivity in constrained environments. Whether you’re producing consumer electronics, automotive modules, medical devices, or aerospace components, the Harrier range offers unmatched flexibility to handle diverse PCB types and production volumes.