SJ Innotech – SPI Series Vision Screen Printers

SJ Innotech have the latest in printing technology combined with 3D inspection on their HP520SPI screen printer. The system has all the usual robust screen printing technology backed up by a tried and tested 3D solder paste inspection module. This inspection process has the ability to feed information directly back to the printer to adjust several parameters to keep the consistency of the printed PCBs to the highest level possible. This industry 4.0 ready printer has a second to none performance rate while not overly sacrificing print speeds.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration

SJ Innotech – SPI Series Vision Screen Printers

SJ Innotech have the latest in printing technology combined with 3D inspection on their HP520SPI screen printer. The system has all the usual robust screen printing technology backed up by a tried and tested 3D solder paste inspection module. This inspection process has the ability to feed information directly back to the printer to adjust several parameters to keep the consistency of the printed PCBs to the highest level possible. This industry 4.0 ready printer has a second to none performance rate while not overly sacrificing print speeds.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration

SJ Innotech – SPI Series

Vision Screen Printers

SJ Innotech have the latest in printing technology combined with 3D inspection on their HP520SPI screen printer. The system has all the usual robust screen printing technology backed up by a tried and tested 3D solder paste inspection module. This inspection process has the ability to feed information directly back to the printer to adjust several parameters to keep the consistency of the printed PCBs to the highest level possible. This industry 4.0 ready printer has a second to none performance rate while not overly sacrificing print speeds.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration

Features and Upgrades

Automatic Stencil Cleaning System

As standard the HP Series of Screen Printers from SJ Innotech come with an Automatic Stencil Cleaning System which uses a two step vacuum cleaning unit with the option of three cleaning methods, IPA, Vacuum and Blower while also allowing for manual cleaning as well if required. After the stencil has been cleaned the system automatically returns to stand by mode ready for the next cleaning interval.

Upgraded 3D Inspection

The SPI machines in the SJ Innotech HP series come with an upgraded 3D Inspection System as standard. The can even further reduce the number final defective products by allowing for a more accurate inspection of excessive solder and shape defects while adding the ability to check for bridges. The system provides real-time feedback and control of the screen printing system through the 3D Inspection system to provide users to develop the best quality products possible.

SPI Offset Control

Taking advantage of the 3D Inspection System the SPI Machines are capable of performing accurate size, height, volume and location inspections of all solder paste deposits. This uses an SPI Offset Communication Control by taking images from each axis to combine these into a single image to determine the offset of each deposit to ensure that it is in the correct location. This increases the productivity and minimises the need for rework on defective boards.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration

Features and Upgrades

Automatic Stencil Cleaning System

As standard the HP Series of Screen Printers from SJ Innotech come with an Automatic Stencil Cleaning System which uses a two step vacuum cleaning unit with the option of three cleaning methods, IPA, Vacuum and Blower while also allowing for manual cleaning as well if required. After the stencil has been cleaned the system automatically returns to stand by mode ready for the next cleaning interval.

Upgraded 3D Inspection

The SPI machines in the SJ Innotech HP series come with an upgraded 3D Inspection System as standard. The can even further reduce the number final defective products by allowing for a more accurate inspection of excessive solder and shape defects while adding the ability to check for bridges. The system provides real-time feedback and control of the screen printing system through the 3D Inspection system to provide users to develop the best quality products possible.

SPI Offset Control

Taking advantage of the 3D Inspection System the SPI Machines are capable of performing accurate size, height, volume and location inspections of all solder paste deposits. This uses an SPI Offset Communication Control by taking images from each axis to combine these into a single image to determine the offset of each deposit to ensure that it is in the correct location. This increases the productivity and minimises the need for rework on defective boards.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration

Features and Upgrades

Automatic Stencil Cleaning System

As standard the HP Series of Screen Printers from SJ Innotech come with an Automatic Stencil Cleaning System which uses a two step vacuum cleaning unit with the option of three cleaning methods, IPA, Vacuum and Blower while also allowing for manual cleaning as well if required. After the stencil has been cleaned the system automatically returns to stand by mode ready for the next cleaning interval.

Upgraded 3D Inspection

The SPI machines in the SJ Innotech HP series come with an upgraded 3D Inspection System as standard. The can even further reduce the number final defective products by allowing for a more accurate inspection of excessive solder and shape defects while adding the ability to check for bridges. The system provides real-time feedback and control of the screen printing system through the 3D Inspection system to provide users to develop the best quality products possible.

SPI Offset Control

Taking advantage of the 3D Inspection System the SPI Machines are capable of performing accurate size, height, volume and location inspections of all solder paste deposits. This uses an SPI Offset Communication Control by taking images from each axis to combine these into a single image to determine the offset of each deposit to ensure that it is in the correct location. This increases the productivity and minimises the need for rework on defective boards.

Request a Brochure
Make an Enquiry
Watch an Online Demonstration
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Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]

Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]

Thank you for your message. It has been sent.
There was an error trying to send your message. Please try again later.

Contact Us

Detech Europe Limited

The Farm Office, Model Farm,

Atwick Road, Bewholme,

East Riding of Yorkshire,

YO25 8DT, United Kingdom

Phone: +44 (0)1262 409944

Email: [email protected]

Thank you for your message. It has been sent.
There was an error trying to send your message. Please try again later.